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2017-2018 產品型錄下載

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LQFP/EP-LQFP Packing Offering
產品環境效益說明
●7x7mm to 28x28mm body size available
●Wide selection of pad size to meet die requirements
●Customized leadframe design capability
●32~256 leads counts available
●Fine pitch wirebond capability
●Pb free process ready and available
●High conductivity copper leadframes
●Low stress die attach materials
●Power enhancement version
●JEDEC standard compliant
●MCM/Syack structure designable and available
 
TQFP/EP-TQFP Packing Offering
●10x10mm to 20x20mm body size available
●Wide selection of pad size to meet die requirements
●Customized leadframe design capability
●44~176 leads counts available
●Fine pitch wirebond capability
●Pb free process ready and available
●High conductivity copper leadframes
●Low stress die attach materials
●Power enhancement version
●JEDEC standard compliant
產品效能
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
銷售區域
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